Home / Products / Capacitors / Ceramic Capacitors / C2012X6S1A685M125AB
Manufacturer Part Number | C2012X6S1A685M125AB |
---|---|
Future Part Number | FT-C2012X6S1A685M125AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X6S1A685M125AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 6.8µF |
Tolerance | ±20% |
Voltage - Rated | 10V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.057" (1.45mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X6S1A685M125AB Weight | Contact Us |
Replacement Part Number | C2012X6S1A685M125AB-FT |
C2012X7T2V153K085AA
TDK Corporation
C2012X7T2V223K125AA
TDK Corporation
C2012X7T2W103M085AE
TDK Corporation
C2012X7T2W153M085AA
TDK Corporation
C2012X8R1E105K125AE
TDK Corporation
C2012X8R1E154K085AA
TDK Corporation
C2012X8R1E154M085AA
TDK Corporation
C2012X8R1H154K125AB
TDK Corporation
C2012X8R1H154M125AB
TDK Corporation
C2012C0G2A223J125AC
TDK Corporation
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation