Home / Products / Capacitors / Ceramic Capacitors / C2012X6S1A106M125AB
Manufacturer Part Number | C2012X6S1A106M125AB |
---|---|
Future Part Number | FT-C2012X6S1A106M125AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X6S1A106M125AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 10µF |
Tolerance | ±20% |
Voltage - Rated | 10V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.057" (1.45mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X6S1A106M125AB Weight | Contact Us |
Replacement Part Number | C2012X6S1A106M125AB-FT |
C2012X5R1A685K060AC
TDK Corporation
C2012X5R1A685K085AB
TDK Corporation
C2012X5R1A685K125AB
TDK Corporation
C2012X5R1A685M060AC
TDK Corporation
C2012X5R1A685M085AB
TDK Corporation
C2012X5R1A685M125AB
TDK Corporation
C2012X5R1C105K/1.25
TDK Corporation
C2012X5R1C105K085AA
TDK Corporation
C2012X5R1C105M/1.25
TDK Corporation
C2012X5R1C105M085AA
TDK Corporation
APA150-FGG256
Microsemi Corporation
M1AFS250-2FG256
Microsemi Corporation
A54SX16-1VQG100
Microsemi Corporation
EPF10K100ABI600-2
Intel
EP2C50U484C8N
Intel
XC6SLX25T-3CSG324C
Xilinx Inc.
XC7A50T-3CSG324E
Xilinx Inc.
LFE2-20SE-6F484C
Lattice Semiconductor Corporation
LCMXO256E-3MN100I
Lattice Semiconductor Corporation
5CEFA7U19C8N
Intel