Home / Products / Capacitors / Ceramic Capacitors / C2012X5R0J226M085AB
Manufacturer Part Number | C2012X5R0J226M085AB |
---|---|
Future Part Number | FT-C2012X5R0J226M085AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X5R0J226M085AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 22µF |
Tolerance | ±20% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.037" (0.95mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X5R0J226M085AB Weight | Contact Us |
Replacement Part Number | C2012X5R0J226M085AB-FT |
C2012JB1H104M085AA
TDK Corporation
C2012JB1H105K085AB
TDK Corporation
C2012JB1H105K125AB
TDK Corporation
C2012JB1H105M085AB
TDK Corporation
C2012JB1H154K085AA
TDK Corporation
C2012JB1H155K125AB
TDK Corporation
C2012JB1H224K125AA
TDK Corporation
C2012JB1H224M125AA
TDK Corporation
C2012JB1H225K085AB
TDK Corporation
C2012JB1H225K125AB
TDK Corporation
XC4005E-3TQ144C
Xilinx Inc.
XC4013XL-3PQ208C
Xilinx Inc.
A3P250-2VQG100
Microsemi Corporation
EP2S30F484C3
Intel
EP3SE50F484C2
Intel
EP3C25F256C6N
Intel
5SGXMA7N1F45I2N
Intel
A3P250L-FGG144
Microsemi Corporation
LCMXO640C-3M132C
Lattice Semiconductor Corporation
EP4SGX180FF35I4N
Intel