Home / Products / Capacitors / Ceramic Capacitors / C2012X5R0J106K085AB
Manufacturer Part Number | C2012X5R0J106K085AB |
---|---|
Future Part Number | FT-C2012X5R0J106K085AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012X5R0J106K085AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 10µF |
Tolerance | ±10% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.037" (0.95mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012X5R0J106K085AB Weight | Contact Us |
Replacement Part Number | C2012X5R0J106K085AB-FT |
C2012JB1E105K125AA
TDK Corporation
C2012JB1E156M125AC
TDK Corporation
C2012JB1E225K125AC
TDK Corporation
C2012JB1E225M085AB
TDK Corporation
C2012JB1E225M125AC
TDK Corporation
C2012JB1E226M125AC
TDK Corporation
C2012JB1E475K125AB
TDK Corporation
C2012JB1E475M085AC
TDK Corporation
C2012JB1E475M125AB
TDK Corporation
C2012JB1E685K125AC
TDK Corporation
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel