Home / Products / Capacitors / Ceramic Capacitors / C2012JB1E335K085AC
Manufacturer Part Number | C2012JB1E335K085AC |
---|---|
Future Part Number | FT-C2012JB1E335K085AC |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012JB1E335K085AC Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 3.3µF |
Tolerance | ±10% |
Voltage - Rated | 25V |
Temperature Coefficient | JB |
Operating Temperature | -25°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.037" (0.95mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012JB1E335K085AC Weight | Contact Us |
Replacement Part Number | C2012JB1E335K085AC-FT |
C2012C0G1H122K060AA
TDK Corporation
C2012C0G1H182J060AA
TDK Corporation
C2012C0G1H222K060AA
TDK Corporation
C2012C0G1V183J060AC
TDK Corporation
C2012C0G1V273J060AC
TDK Corporation
C2012C0G2A182J085AA
TDK Corporation
C2012C0G2E122J085AA
TDK Corporation
C2012C0G2E122K085AA
TDK Corporation
C2012C0G2E182J125AA
TDK Corporation
C2012C0G2E222K125AA
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel