Home / Products / Capacitors / Ceramic Capacitors / C2012C0G2E562K125AA
Manufacturer Part Number | C2012C0G2E562K125AA |
---|---|
Future Part Number | FT-C2012C0G2E562K125AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012C0G2E562K125AA Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 5600pF |
Tolerance | ±10% |
Voltage - Rated | 250V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.057" (1.45mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012C0G2E562K125AA Weight | Contact Us |
Replacement Part Number | C2012C0G2E562K125AA-FT |
C2012JB1A226M125AB
TDK Corporation
C2012JB1A475M060AB
TDK Corporation
C2012JB1A685K060AC
TDK Corporation
C2012JB1A685M060AC
TDK Corporation
C2012JB1C105M085AA
TDK Corporation
C2012JB1C225M085AC
TDK Corporation
C2012JB1C335M060AC
TDK Corporation
C2012JB1C475M085AB
TDK Corporation
C2012JB1C685M085AC
TDK Corporation
C2012JB1E106M085AC
TDK Corporation
A3P125-2TQ144I
Microsemi Corporation
XC3SD3400A-4FG676C
Xilinx Inc.
M1A3P1000L-1FG256
Microsemi Corporation
A1425A-1VQG100C
Microsemi Corporation
EP3C25F256C7ES
Intel
5SGXEA9N2F45C3N
Intel
5SGXEA3K1F35I2N
Intel
XC5VLX30-1FFG324C
Xilinx Inc.
LFE3-70EA-9FN484C
Lattice Semiconductor Corporation
5CEFA2F23I7
Intel