Home / Products / Capacitors / Ceramic Capacitors / C2012C0G1H333K125AA
Manufacturer Part Number | C2012C0G1H333K125AA |
---|---|
Future Part Number | FT-C2012C0G1H333K125AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012C0G1H333K125AA Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.033µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.057" (1.45mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012C0G1H333K125AA Weight | Contact Us |
Replacement Part Number | C2012C0G1H333K125AA-FT |
C2012X7R2A223M125AE
TDK Corporation
C2012X7R2E223M125AE
TDK Corporation
C2012X7R2E682K125AM
TDK Corporation
C2012X7R2E682M125AA
TDK Corporation
C2012X7S0G156M125AC
TDK Corporation
C2012X7S1C685K125AC
TDK Corporation
C2012X7S2A334M125AB
TDK Corporation
C2012X8L0J685K125AC
TDK Corporation
C2012X8L1C335K125AC
TDK Corporation
C2012X8R1C105M125AB
TDK Corporation
XC4005E-3TQ144C
Xilinx Inc.
XC4013XL-3PQ208C
Xilinx Inc.
A3P250-2VQG100
Microsemi Corporation
EP2S30F484C3
Intel
EP3SE50F484C2
Intel
EP3C25F256C6N
Intel
5SGXMA7N1F45I2N
Intel
A3P250L-FGG144
Microsemi Corporation
LCMXO640C-3M132C
Lattice Semiconductor Corporation
EP4SGX180FF35I4N
Intel