Home / Products / Capacitors / Ceramic Capacitors / C2012C0G1H272J/1.25
Manufacturer Part Number | C2012C0G1H272J/1.25 |
---|---|
Future Part Number | FT-C2012C0G1H272J/1.25 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012C0G1H272J/1.25 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 2700pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.057" (1.45mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012C0G1H272J/1.25 Weight | Contact Us |
Replacement Part Number | C2012C0G1H272J/1.25-FT |
C2012X7R1H154M125AA
TDK Corporation
C2012X7R1H155K125AC
TDK Corporation
C2012X7R1H155M125AC
TDK Corporation
C2012X7R1H474M125AE
TDK Corporation
C2012X7R1V225K125AB
TDK Corporation
C2012X7R1V684M125AB
TDK Corporation
C2012X7R2A104M125AE
TDK Corporation
C2012X7R2A223M125AE
TDK Corporation
C2012X7R2E223M125AE
TDK Corporation
C2012X7R2E682K125AM
TDK Corporation
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation