Home / Products / Capacitors / Ceramic Capacitors / C2012C0G1H153K085AA
Manufacturer Part Number | C2012C0G1H153K085AA |
---|---|
Future Part Number | FT-C2012C0G1H153K085AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C2012C0G1H153K085AA Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.015µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0805 (2012 Metric) |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.039" (1.00mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C2012C0G1H153K085AA Weight | Contact Us |
Replacement Part Number | C2012C0G1H153K085AA-FT |
C2012X6S1H684K125AB
TDK Corporation
C2012X6S1H684M125AB
TDK Corporation
C2012X6S1V155K125AB
TDK Corporation
C2012X6S1V155M125AB
TDK Corporation
C2012X6S1V335K125AB
TDK Corporation
C2012X6S1V335M125AB
TDK Corporation
C2012X7R0J685M125AB
TDK Corporation
C2012X7R1C155M125AB
TDK Corporation
C2012X7R1C225M125AB
TDK Corporation
C2012X7R1E335M125AB
TDK Corporation
XC4006E-4TQ144I
Xilinx Inc.
LFXP3C-4T100I
Lattice Semiconductor Corporation
EP3C16F484A7N
Intel
EP2C5F256I8N
Intel
5SGXMA5N2F40C2N
Intel
5SGSED8N1F45C2LN
Intel
APA750-FGG676I
Microsemi Corporation
A40MX02-2PQG100
Microsemi Corporation
LFE3-150EA-7FN1156I
Lattice Semiconductor Corporation
10AX115R3F40E2SG
Intel