Home / Products / Capacitors / Ceramic Capacitors / C1608X8R1H472M080AE
Manufacturer Part Number | C1608X8R1H472M080AE |
---|---|
Future Part Number | FT-C1608X8R1H472M080AE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C1608X8R1H472M080AE Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 4700pF |
Tolerance | ±20% |
Voltage - Rated | 50V |
Temperature Coefficient | X8R |
Operating Temperature | -55°C ~ 150°C |
Features | Soft Termination |
Ratings | - |
Applications | Boardflex Sensitive |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C1608X8R1H472M080AE Weight | Contact Us |
Replacement Part Number | C1608X8R1H472M080AE-FT |
C1608X7R1H683K080AA
TDK Corporation
C1608X7R1H683M080AA
TDK Corporation
C1608X7R1V105K080AC
TDK Corporation
C1608X7R1V105M080AC
TDK Corporation
C1608X7R1V154M080AB
TDK Corporation
C1608X7R1V224K080AB
TDK Corporation
C1608X7R1V224M080AB
TDK Corporation
C1608X7R1V334K080AB
TDK Corporation
C1608X7R1V334M080AB
TDK Corporation
C1608X7R1V474K080AB
TDK Corporation
XCV100E-8FG256C
Xilinx Inc.
M2GL050T-1FGG484
Microsemi Corporation
A3P250L-1VQ100
Microsemi Corporation
EP3C80F484C8
Intel
5CEBA4F17C6N
Intel
5SGXEA5N3F45C2N
Intel
XC2V1500-5FFG896I
Xilinx Inc.
A54SX32A-2BG329I
Microsemi Corporation
A3PE1500-1FGG676I
Microsemi Corporation
EPF10K100EQC240-1
Intel