Home / Products / Capacitors / Ceramic Capacitors / C1608X6S1V474K080AB
Manufacturer Part Number | C1608X6S1V474K080AB |
---|---|
Future Part Number | FT-C1608X6S1V474K080AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C1608X6S1V474K080AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.47µF |
Tolerance | ±10% |
Voltage - Rated | 35V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C1608X6S1V474K080AB Weight | Contact Us |
Replacement Part Number | C1608X6S1V474K080AB-FT |
C1608CH2E121J080AA
TDK Corporation
C1608CH2E121K080AA
TDK Corporation
C1608CH2E122J080AA
TDK Corporation
C1608CH2E122K080AA
TDK Corporation
C1608CH2E151J080AA
TDK Corporation
C1608CH2E152J080AA
TDK Corporation
C1608CH2E152K080AA
TDK Corporation
C1608CH2E181J080AA
TDK Corporation
C1608CH2E181K080AA
TDK Corporation
C1608CH2E182J080AA
TDK Corporation
A3P015-QNG68
Microsemi Corporation
M1AGL600V2-FG256
Microsemi Corporation
EP3C120F484C7N
Intel
EP2AGX65DF25I5N
Intel
EP4S100G4F45I1
Intel
5SGXEB6R2F43C3
Intel
XC6SLX16-2CPG196C
Xilinx Inc.
AGLP030V2-CS289I
Microsemi Corporation
LCMXO2-4000ZE-1MG132C
Lattice Semiconductor Corporation
EPF10K10LC84-3
Intel