Home / Products / Capacitors / Ceramic Capacitors / C1608X6S1V334M080AB
Manufacturer Part Number | C1608X6S1V334M080AB |
---|---|
Future Part Number | FT-C1608X6S1V334M080AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C1608X6S1V334M080AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.33µF |
Tolerance | ±20% |
Voltage - Rated | 35V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C1608X6S1V334M080AB Weight | Contact Us |
Replacement Part Number | C1608X6S1V334M080AB-FT |
C1608CH2A821K080AA
TDK Corporation
C1608CH2E121J080AA
TDK Corporation
C1608CH2E121K080AA
TDK Corporation
C1608CH2E122J080AA
TDK Corporation
C1608CH2E122K080AA
TDK Corporation
C1608CH2E151J080AA
TDK Corporation
C1608CH2E152J080AA
TDK Corporation
C1608CH2E152K080AA
TDK Corporation
C1608CH2E181J080AA
TDK Corporation
C1608CH2E181K080AA
TDK Corporation
XC2S100E-6PQ208C
Xilinx Inc.
A3PE3000-2PQ208I
Microsemi Corporation
10CL006YU256C8G
Intel
10M04SCU169A7G
Intel
5SGXEA9N2F45I2N
Intel
XC6SLX25-3CSG324C
Xilinx Inc.
A54SX32A-1TQG100
Microsemi Corporation
LFE3-17EA-7LMG328I
Lattice Semiconductor Corporation
ICE40LP8K-CM121
Lattice Semiconductor Corporation
EP20K1000EBC652-1
Intel