Home / Products / Capacitors / Ceramic Capacitors / C1608X6S1A155K080AB
Manufacturer Part Number | C1608X6S1A155K080AB |
---|---|
Future Part Number | FT-C1608X6S1A155K080AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C1608X6S1A155K080AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1.5µF |
Tolerance | ±10% |
Voltage - Rated | 10V |
Temperature Coefficient | X6S |
Operating Temperature | -55°C ~ 105°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C1608X6S1A155K080AB Weight | Contact Us |
Replacement Part Number | C1608X6S1A155K080AB-FT |
C1608CH2A272J080AA
TDK Corporation
C1608CH2A272K080AA
TDK Corporation
C1608CH2A390J080AA
TDK Corporation
C1608CH2A391J080AA
TDK Corporation
C1608CH2A470J080AA
TDK Corporation
C1608CH2A471K080AA
TDK Corporation
C1608CH2A4R7C080AA
TDK Corporation
C1608CH2A560J080AA
TDK Corporation
C1608CH2A681J080AA
TDK Corporation
C1608CH2A681K080AA
TDK Corporation
AGLN015V5-QNG68
Microsemi Corporation
XC6SLX100T-3FG676I
Xilinx Inc.
M1A3PE3000-FG484
Microsemi Corporation
M2GL050T-1VF400I
Microsemi Corporation
LAE3-17EA-6FTN256E
Lattice Semiconductor Corporation
5SGXEA7H3F35I4N
Intel
XC7V585T-L2FFG1157E
Xilinx Inc.
APA075-TQ100
Microsemi Corporation
EP2C5Q208C8N
Intel
EP20K30EQC208-1
Intel