Home / Products / Capacitors / Ceramic Capacitors / C1608JB1H334M080AB
Manufacturer Part Number | C1608JB1H334M080AB |
---|---|
Future Part Number | FT-C1608JB1H334M080AB |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C1608JB1H334M080AB Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.33µF |
Tolerance | ±20% |
Voltage - Rated | 50V |
Temperature Coefficient | JB |
Operating Temperature | -25°C ~ 85°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0603 (1608 Metric) |
Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.035" (0.90mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C1608JB1H334M080AB Weight | Contact Us |
Replacement Part Number | C1608JB1H334M080AB-FT |
C1608C0G1H181K080AA
TDK Corporation
C1608C0G1H222J080AA
TDK Corporation
C1608C0G2A020C080AA
TDK Corporation
C1608C0G2A050C080AA
TDK Corporation
C1608C0G2A060D080AA
TDK Corporation
C1608C0G2A080D080AA
TDK Corporation
C1608C0G2A122K080AA
TDK Corporation
C1608C0G2A222J080AA
TDK Corporation
C1608C0G2A271J080AA
TDK Corporation
C1608C0G2A330J080AA
TDK Corporation
A3P125-2TQ144I
Microsemi Corporation
XC3SD3400A-4FG676C
Xilinx Inc.
M1A3P1000L-1FG256
Microsemi Corporation
A1425A-1VQG100C
Microsemi Corporation
EP3C25F256C7ES
Intel
5SGXEA9N2F45C3N
Intel
5SGXEA3K1F35I2N
Intel
XC5VLX30-1FFG324C
Xilinx Inc.
LFE3-70EA-9FN484C
Lattice Semiconductor Corporation
5CEFA2F23I7
Intel