Home / Products / Capacitors / Ceramic Capacitors / C0402C0G1C8R2C
Manufacturer Part Number | C0402C0G1C8R2C |
---|---|
Future Part Number | FT-C0402C0G1C8R2C |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C0402C0G1C8R2C Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 8.2pF |
Tolerance | ±0.25pF |
Voltage - Rated | 16V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 01005 (0402 Metric) |
Size / Dimension | 0.016" L x 0.008" W (0.40mm x 0.20mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.009" (0.22mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C0402C0G1C8R2C Weight | Contact Us |
Replacement Part Number | C0402C0G1C8R2C-FT |
C0402C0G1C0R5C020BC
TDK Corporation
C0402C0G1C0R5W
TDK Corporation
C0402C0G1C0R6B
TDK Corporation
C0402C0G1C0R6W
TDK Corporation
C0402C0G1C0R7B
TDK Corporation
C0402C0G1C0R7W
TDK Corporation
C0402C0G1C0R8B
TDK Corporation
C0402C0G1C0R8W
TDK Corporation
C0402C0G1C0R9B
TDK Corporation
C0402C0G1C0R9W
TDK Corporation
A54SX32A-TQ144
Microsemi Corporation
XA6SLX9-2FTG256Q
Xilinx Inc.
M2GL050-1FCSG325
Microsemi Corporation
M1A3P600L-FGG484
Microsemi Corporation
EPF10K50SFC484-1N
Intel
10CX150YF672E6G
Intel
10M16SCU324I7G
Intel
EPF10K100ABC356-3
Intel
EPF10K200SRC240-1N
Intel
5CGXFC9E6F35C7N
Intel