Home / Products / Integrated Circuits (ICs) / Interface - Telecom / BU8874
Manufacturer Part Number | BU8874 |
---|---|
Future Part Number | FT-BU8874 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
BU8874 Status (Lifecycle) | In Stock |
Part Status | Last Time Buy |
Function | Receiver, DTMF |
Interface | - |
Number of Circuits | 1 |
Voltage - Supply | 4.75V ~ 5.25V |
Current - Supply | 2.2mA |
Power (Watts) | 500mW |
Operating Temperature | -10°C ~ 70°C |
Mounting Type | Through Hole |
Package / Case | 8-DIP (0.300", 7.62mm) |
Supplier Device Package | 8-DIP |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
BU8874 Weight | Contact Us |
Replacement Part Number | BU8874-FT |
SI3019-F-FTR
Silicon Labs
SI3019-F-GT
Silicon Labs
SI3019-F-FT
Silicon Labs
SI3019-F-GTR
Silicon Labs
SI3018-F-FT
Silicon Labs
SI3018-FT
Silicon Labs
SI3018-KT
Silicon Labs
SI3019-C-FT
Silicon Labs
SI3019-KT
Silicon Labs
XRT85L61IG
MaxLinear, Inc.
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
EP4CE6F17C8N
Intel
EP4SGX180KF40C3N
Intel
EP2AGZ300HF40C3N
Intel
10AX027E2F29E2LG
Intel
XC7VX485T-1FF1157I
Xilinx Inc.
XC4VSX55-12FF1148C
Xilinx Inc.
AGL125V2-CS196I
Microsemi Corporation
LFE3-35EA-8FN672C
Lattice Semiconductor Corporation
EPF6016AQC208-3
Intel