Home / Products / Resistors / Chassis Mount Resistors / BDS2A1006K8K
Manufacturer Part Number | BDS2A1006K8K |
---|---|
Future Part Number | FT-BDS2A1006K8K |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | BDS, CGS |
BDS2A1006K8K Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 6.8 kOhms |
Tolerance | ±10% |
Power (Watts) | 100W |
Composition | Thick Film |
Temperature Coefficient | ±150ppm/°C |
Operating Temperature | -55°C ~ 125°C |
Features | RF, High Frequency |
Coating, Housing Type | Epoxy Coated |
Mounting Feature | Flanges |
Size / Dimension | 1.488" L x 1.000" W (37.80mm x 25.40mm) |
Height - Seated (Max) | 0.827" (21.00mm) |
Lead Style | M4 Threaded |
Package / Case | SOT-227-2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
BDS2A1006K8K Weight | Contact Us |
Replacement Part Number | BDS2A1006K8K-FT |
THS756R8J
TE Connectivity Passive Product
THS75470RJ
TE Connectivity Passive Product
THS75510RJ
TE Connectivity Passive Product
THS75100RJ
TE Connectivity Passive Product
THS1010KJ
TE Connectivity Passive Product
THS7547RJ
TE Connectivity Passive Product
THS7533RJ
TE Connectivity Passive Product
THS7522RJ
TE Connectivity Passive Product
THS10R18J
TE Connectivity Passive Product
THS256R8J
TE Connectivity Passive Product
AT6003ALV-4AC
Microchip Technology
XCKU060-3FFVA1517E
Xilinx Inc.
APA600-FGG256
Microsemi Corporation
APA1000-CQ208B
Microsemi Corporation
5SGXEA7N3F40C4N
Intel
5SGXEB9R1H43C2N
Intel
5SGXEBBR2H43I2LN
Intel
XC4VSX55-10FFG1148C
Xilinx Inc.
EP20K1000CB652C7N
Intel
5SGSMD4H2F35I2N
Intel