Home / Products / Resistors / Chassis Mount Resistors / BDS2A1001K0K
Manufacturer Part Number | BDS2A1001K0K |
---|---|
Future Part Number | FT-BDS2A1001K0K |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | BDS, CGS |
BDS2A1001K0K Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 1 kOhms |
Tolerance | ±10% |
Power (Watts) | 100W |
Composition | Thick Film |
Temperature Coefficient | ±150ppm/°C |
Operating Temperature | -55°C ~ 125°C |
Features | RF, High Frequency |
Coating, Housing Type | Epoxy Coated |
Mounting Feature | Flanges |
Size / Dimension | 1.488" L x 1.000" W (37.80mm x 25.40mm) |
Height - Seated (Max) | 0.827" (21.00mm) |
Lead Style | M4 Threaded |
Package / Case | SOT-227-2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
BDS2A1001K0K Weight | Contact Us |
Replacement Part Number | BDS2A1001K0K-FT |
THS50R01J
TE Connectivity Passive Product
THS255R0J
TE Connectivity Passive Product
THS2512RJ
TE Connectivity Passive Product
THS50R02J
TE Connectivity Passive Product
THS25R47J
TE Connectivity Passive Product
THS75150RJ
TE Connectivity Passive Product
THS75220RJ
TE Connectivity Passive Product
THS75680RJ
TE Connectivity Passive Product
THS756R8J
TE Connectivity Passive Product
THS75470RJ
TE Connectivity Passive Product
AT6003ALV-4AC
Microchip Technology
XCKU060-3FFVA1517E
Xilinx Inc.
APA600-FGG256
Microsemi Corporation
APA1000-CQ208B
Microsemi Corporation
5SGXEA7N3F40C4N
Intel
5SGXEB9R1H43C2N
Intel
5SGXEBBR2H43I2LN
Intel
XC4VSX55-10FFG1148C
Xilinx Inc.
EP20K1000CB652C7N
Intel
5SGSMD4H2F35I2N
Intel