Home / Products / Capacitors / Ceramic Capacitors / B37979N5561J000
Manufacturer Part Number | B37979N5561J000 |
---|---|
Future Part Number | FT-B37979N5561J000 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | B37979N |
B37979N5561J000 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 560pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | RF, Microwave, High Frequency |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.197" W (5.50mm x 5.00mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
B37979N5561J000 Weight | Contact Us |
Replacement Part Number | B37979N5561J000-FT |
B37979G5221J000
EPCOS (TDK)
B37979G5102J051
EPCOS (TDK)
B37979G5101J051
EPCOS (TDK)
B37979G5101J000
EPCOS (TDK)
B37979G1681J051
EPCOS (TDK)
B37979G1471J051
EPCOS (TDK)
B37979G1470J051
EPCOS (TDK)
B37979G1470J000
EPCOS (TDK)
B37979G1331J051
EPCOS (TDK)
B37979G1330J051
EPCOS (TDK)
LCMXO2-1200HC-4TG144I
Lattice Semiconductor Corporation
XC3SD3400A-4FGG676I
Xilinx Inc.
A3P125-PQ208
Microsemi Corporation
M1A3P250-2VQ100
Microsemi Corporation
5SGXEA7K3F40I4N
Intel
EP3SE80F1152I4
Intel
A40MX02-3PLG44
Microsemi Corporation
XC6SLX9-3CSG324I
Xilinx Inc.
10AX115N4F40E3SG
Intel
5CGXFC9E7F35C8N
Intel