Home / Products / Capacitors / Ceramic Capacitors / B37979N1150J000
Manufacturer Part Number | B37979N1150J000 |
---|---|
Future Part Number | FT-B37979N1150J000 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | B37979N |
B37979N1150J000 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 15pF |
Tolerance | ±5% |
Voltage - Rated | 100V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | RF, Microwave, High Frequency |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.197" W (5.50mm x 5.00mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
B37979N1150J000 Weight | Contact Us |
Replacement Part Number | B37979N1150J000-FT |
B37981M1682K054
EPCOS (TDK)
B37981M5103K000
EPCOS (TDK)
B37981M5103K054
EPCOS (TDK)
B37981M5153K000
EPCOS (TDK)
B37981M5153K054
EPCOS (TDK)
B37981M5223K000
EPCOS (TDK)
B37981M5223K054
EPCOS (TDK)
B37981M5332K000
EPCOS (TDK)
B37981M5332K051
EPCOS (TDK)
B37981M5472K000
EPCOS (TDK)
XC6SLX75-3CSG484I
Xilinx Inc.
XC4062XL-1HQ304C
Xilinx Inc.
XC3S500E-4PQ208I
Xilinx Inc.
A3P600-2FG256I
Microsemi Corporation
AFS600-1FG256I
Microsemi Corporation
M1A3P400-1FG256
Microsemi Corporation
EP1S20F484C5
Intel
10M16DAF256I7G
Intel
5SGXEA9N3F45C2N
Intel
A54SX32A-1BG329
Microsemi Corporation