Home / Products / Integrated Circuits (ICs) / Memory / AS4C256M16D3-12BIN
Manufacturer Part Number | AS4C256M16D3-12BIN |
---|---|
Future Part Number | FT-AS4C256M16D3-12BIN |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
AS4C256M16D3-12BIN Status (Lifecycle) | In Stock |
Part Status | Discontinued at Future Semiconductor |
Memory Type | Volatile |
Memory Format | DRAM |
Technology | SDRAM - DDR3 |
Memory Size | 4Gb (256M x 16) |
Clock Frequency | 800MHz |
Write Cycle Time - Word, Page | 15ns |
Access Time | 20ns |
Memory Interface | Parallel |
Voltage - Supply | 1.425V ~ 1.575V |
Operating Temperature | -40°C ~ 95°C (TC) |
Mounting Type | Surface Mount |
Package / Case | 96-TFBGA |
Supplier Device Package | 96-FBGA (13x9) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
AS4C256M16D3-12BIN Weight | Contact Us |
Replacement Part Number | AS4C256M16D3-12BIN-FT |
AS7C256A-12TIN
Alliance Memory, Inc.
AS7C256A-12TINTR
Alliance Memory, Inc.
AS7C256A-15TCN
Alliance Memory, Inc.
AS7C256A-15TCNTR
Alliance Memory, Inc.
AS7C256A-15TIN
Alliance Memory, Inc.
AS7C256A-15TINTR
Alliance Memory, Inc.
AS7C256A-20TCN
Alliance Memory, Inc.
AS7C256A-20TCNTR
Alliance Memory, Inc.
AS7C256A-20TIN
Alliance Memory, Inc.
AS7C256A-20TINTR
Alliance Memory, Inc.
XC4006E-3TQ144C
Xilinx Inc.
XC6SLX150T-N3FGG900C
Xilinx Inc.
LFE3-17EA-6FTN256I
Lattice Semiconductor Corporation
10M08DCF484I7G
Intel
EP3CLS150F484C8
Intel
EP4CE115F23C7
Intel
XC2VP20-6FFG1152I
Xilinx Inc.
LCMXO2-4000HE-6BG256I
Lattice Semiconductor Corporation
10AX027E2F27E1HG
Intel
EP4SGX360HF35I3N
Intel