Home / Products / Integrated Circuits (ICs) / Memory / 602-20011
Manufacturer Part Number | 602-20011 |
---|---|
Future Part Number | FT-602-20011 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
602-20011 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Memory Type | Non-Volatile |
Memory Format | EEPROM |
Technology | EEPROM |
Memory Size | 4Kb (512 x 8) |
Clock Frequency | 2MHz |
Write Cycle Time - Word, Page | 6ms |
Access Time | - |
Memory Interface | SPI |
Voltage - Supply | 1.8V ~ 5.5V |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package | 8-SOIC |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
602-20011 Weight | Contact Us |
Replacement Part Number | 602-20011-FT |
GD25Q20CSIG
GigaDevice Semiconductor (HK) Limited
GD25Q20CSIGR
GigaDevice Semiconductor (HK) Limited
GD25Q20CTIG
GigaDevice Semiconductor (HK) Limited
GD25Q32CSJG
GigaDevice Semiconductor (HK) Limited
GD25Q32CSJGR
GigaDevice Semiconductor (HK) Limited
GD25Q32CTIG
GigaDevice Semiconductor (HK) Limited
GD25Q32CTIGR
GigaDevice Semiconductor (HK) Limited
GD25Q40CSIG
GigaDevice Semiconductor (HK) Limited
GD25Q40CTIG
GigaDevice Semiconductor (HK) Limited
GD25Q64CSIG
GigaDevice Semiconductor (HK) Limited
LCMXO2-1200ZE-1UWG25ITR
Lattice Semiconductor Corporation
EP1S25B672C6N
Intel
XC2V1000-4BGG575C
Xilinx Inc.
XC5VLX50T-2FFG1136C
Xilinx Inc.
AGL125V5-QNG132
Microsemi Corporation
ICE40LP1K-CM121
Lattice Semiconductor Corporation
LFE3-35EA-8LFN484C
Lattice Semiconductor Corporation
EP2AGX45DF29C4N
Intel
EPF10K30RC208-3N
Intel
5SGXMA3H1F35C1N
Intel